The Ventilus Pilot is described by the company as a mobile all-rounder for pilot scale applications
Romaco will attend the upcoming Vitafoods Europe 2021 exhibition to demonstrate its processing portfolio for manufacturers of nutraceuticals and pharmaceuticals. The company also be debuting its Ventilus Pilot fluid bed processor at the international trade show.
The company will focus on three product brands: Innojet, Kilian and Tecpharm. The equipment is used to granulate, tablet and coat solid products. The Ventilus Pilot is described by the company as a mobile all-rounder for pilot scale applications which features excellent flow properties as well as powder and granulate compressibility and transferability. The technology is suitable for processing natural and sustainable formulations without any chemical additives, such as nutraceuticals like algae powder.
Mounted on four wheels, the device reportedly fits through any standard door frame and is designed for plug & play installation. The pilot scale machine can also optionally be supplied as an in-wall version. The fluid bed processor is intended for batch sizes from 4 to 25 L and meets the requirements for laboratory use as well as for GMP production of clinical samples, the company says.
The device dries, granulates or coats particles of any size from 10 μm to 2 mm depending on requirements. The spray liquid is applied using a bottom spray system with the central Rotojet nozzle or alternatively by means of the conventional top spray method. The cylindrical product container featuring the Orbiter booster is designed to enable controlled, gentle batch intermixing. The resulting flow conditions reportedly reduce the processing time and the spray liquid consumption while simplifying scale-up to production level.
Hot melt processes are also possible using the Ventilus Pilot, although the Innojet IHD hot melt system must merely be connected to the processor for this purpose. This process is recommended as a taste mask or moisture barrier as well as for controlled API release. Hot melt coating applications are suggested by the manufacturer as a way to reduce the carbon footprint of the device.